Book Description
This digital document is an article from Electronic Materials Update, published by Business Communications Company, Inc. on August 1, 2003. The length of the article is 464 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.Citation Details
Title: LITHOGRAPHY & PHOTORESISTS: Product Helps Overcome Pattern Collapse.
Publication: Electronic Materials Update (Newsletter)
Date: August 1, 2003
Publisher: Business Communications Company, Inc.
Volume: 17 Issue: 7Distributed by Thompson Gale
Excerpt. © Reprinted by permission. All rights reserved.
A new surfactant from Air Products Electronic Specialty Materials can help overcome pattern collapse, a major obstacle in 193-nm photolithography. According to the company, its tradenamed OptiPattern surface conditioning solution results in a 25% improvement in critical dimension (CD) uniformity and significantly reduced pattern collapse, when used with one of its existing photoresist developers.
Photolithography is an enabling procedure in the semiconductor chip manufacturing process, in which circuit patterns are transferred to the surface of the chip by shining ultraviolet (UV) light through a high-resolution mask-similar to a stencil. This exposes photoresist on the chip's surface. After exposure, the photoresist is developed, rinsed, and dried.
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