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This digital document is an article from Electronic Materials Update, published by Business Communications Company, Inc. on September 1, 2003. The length of the article is 860 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.Citation Details
Title: LITHOGRAPHY & PHOTORESISTS: Combining Lithography With Self-Assembly.
Publication: Electronic Materials Update (Newsletter)
Date: September 1, 2003
Publisher: Business Communications Company, Inc.
Volume: 17 Issue: 8Distributed by Thompson Gale
Excerpt. © Reprinted by permission. All rights reserved.
Scientists at the University of Wisconsin have demonstrated a technique that successfully combines photolithography with self- assembly at the nanoscale. The hybrid technique could one day allow electronic devices to assemble themselves automatically, say the scientists.
Paul Nealey and his team at the University's Materials Research Science and Engineering Center (MRSEC) on Nanostructures, Materials, and Interfaces have been able to combine extreme ultraviolet (EUV) lithography with self-assembly of block copolymers to produce a parallel line pattern. The research, published in the July 24, 2003 issue of Nature, was supported by the National Science Foundation (NSF).