High-Speed Circuit Board Signal Integrity (Artech House Microwave Library (Hardcover))
- Book Review,
by Stephen C. Thierauf
From Book News, Inc.
Discussing both design and debugging issues at gigabit-per-second data rates, this book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Formulas, terminology, and a refresher on basic electrostatic and electromagnetic principals will be useful for signal integrity engineers. High-speed circuit designers will find an entry into the electromagnetics and physics of high-speed signaling. The book introduces concepts fundamental to high-speed signaling, such as lossy transmission line behavior, skin effect, and characteristics of laminates. Focus is on the effects of dielectric and conductor loss on signal quality, with particular emphasis on serial differential signaling. Thierauf is a scientist in the private sector.Copyright © 2004 Book News, Inc., Portland, OR
Book Description
As circuit boards are increasingly required to transmit signals at higher and higher speeds, signal and power integrity become increasingly crucial. Rules of thumb that you have used over and over again to prevent signal loss no longer apply to these new, high-speed, high-density circuit designs. This leading-edge circuit design resource offers you the knowledge needed to quickly pinpoint transmission problems that can compromise your entire circuit design. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for your projects involving high-speed serial signaling on printed circuit boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that you can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.
Download Description
As circuit boards are increasingly required to transmit signals at higher and higher speeds, signal and power integrity become increasingly crucial. Rules of thumb that you have used over and over again to prevent signal loss no longer apply to these new, high-speed, high-density circuit designs. This leading-edge circuit design resource offers you the knowledge needed to quickly pinpoint transmission problems that can compromise your entire circuit design. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for your projects involving high-speed serial signaling on printed circuit boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that you can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.
Book Info
Text offers the knowledge needed to quickly pinpoint transmission problems that can compromise an entire circuit design. Discusses design and debugging issues at gigabit-per-second data rates, ISI and dispersion, antipads and nonfunctional pads, and more. For electrical engineers. Includes index, references, and appendix.
About the Author
Stephen C. Thierauf served as senior consulting hardware engineer at Fabric Networks, Inc. While working at Compaq Computers and Digital Equipment Corporation, he was a senior member of the technical staff responsible for the design and signal integrity analysis of high-speed I/O circuitry and interconnect on the ALPHA microprocessor. Formerly a visiting scholar at Northeastern University, he holds a B.S. in engineering technology from Wentworth College of Technology, Boston, MA.
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