Advances in Cryogenic Engineering: Proceedings of the International Cryogenic Materials Conference Icmc (Advances in Cryogenic Engineering) - Book Review,
by B. Baluchandran (Editor), et al

From Book News, Inc. This two-volume set contains some of the papers presented at the July 2001 conference; others appear in v.47 (also in two volumes) of the same title. Thirty-seven contributions in Part A cover cryogenic magnetic materials; materials testing; physical and mechanical properties at cryogenic temperatures; structural materials testing; cryogenic deformation and fracture of metals and alloys; non-metallic materials; and non-metallic materials testing, insulation, and process and development. Part B (112 articles) addresses issues for high-field HTS insert coils, HTS bulk, HTS electronics and thin films, HTS coated conductors (substrate and buffer layers, and superconductor deposition), advances in HTS coated conductors for electric power applications, development of large-grain rare-earth doped YBCO bulk at ISTEC, BSCCO conductors, HTS mechanisms, other LTS, E-J characteristics, stability and AC losses, and flux pinning and vortex dynamics. Includes a CD-ROM version. The conference series was formerly published by Plenum Press.Copyright © 2004 Book News, Inc., Portland, OR
Book Description All papers have been peer reviewed. The International Cryogenic Materials Conference covers the development and properties of insulation and structural materials used to construct cryogenic devices and for cryogenic applications. It also deals with the study of low and high temperature superconducting materials that are used in wire form for conductor applications such as cables for high field magnets, motors, transmission lines, transformers,and fault current limiters, for thin film applications in electronic devices, and bulk form for levitation and applications. One session was devoted to the new magnesium boride (MgB2) superconductors.
Book Info Proceedings of the Intl Cryogenic Materials Conference-ICMC, Volume 48, held July 16-20, 2001 in Madison, Wisconsin, USA. Covers the development and properties of insulation and structural materials used to construct cryogenic devices and for cryogenic applications.
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